Bedford, MA – October 7, 2015 – 1366 Technologies today announced plans to build a state-of-the-art, commercial solar wafer manufacturing facility in Genesee County New York, strategically located between Buffalo and Rochester, that will eventually scale to 3 GW, house 400 Direct Wafer™ furnaces, and produce more than 600 million high-performance silicon wafers per year – enough to power 360,000 American homes. 1366 Technologies will become the anchor tenant at the high-tech Science and Technology Advanced Manufacturing Park (STAMP) where the company will eventually create more than 1,000 new, full-time jobs in New York’s Finger Lakes Region.
“Today is an exciting day, the culmination of a lot of hard work by a talented group of people. From day one, we have taken a deliberate, highly-measured path to scaling. The facility in Bedford, Massachusetts was our proving ground. New York brings us to commercial scale. The technology is ready and 1366 is squarely positioned to lead in an industry undergoing rapid global growth,” said Frank van Mierlo, CEO, 1366 Technologies. “We are extremely proud to become part of the Upstate New York community and are committed to the region’s vibrant future.”
The site selection marks the start of a phased program to methodically scale 1366 Technologies Direct Wafer™ technology – a transformative manufacturing process that produces a uniformly better silicon solar wafer at half the cost – from 250 MW to 3 GW. 1366 Technologies will first construct a 250 MW facility that will produce more than 50 million standard silicon wafers per year. The facility will quickly ramp to 1 GW of production capacity and employ 300 people.
“Our goal has always been two-fold: deliver solar at the cost of coal and manufacture – at scale – in the United States,” continued van Mierlo. “Today’s announcement signifies that we’re on our way to achieving both.”
To encourage 1366 Technologies to invest and establish operations in New York, Governor Cuomo’s administration offered a competitive and attractive incentive package through various state and local resources including Empire State Development, New York’s chief economic development agency; New York State Energy Research and Development Authority (NYSERDA); New York State Homes and Community Renewal (HCR); New York Power Authority (NYPA); and Genesee County Industrial Development Agency. In September 2011, 1366 was also issued a $150 million loan guarantee from the U.S. Department of Energy (DOE) to build a commercial-scale manufacturing facility.
Construction of the 130,000 square-foot facility is slated to begin no later than Q2 of 2016 and is expected to be completed in 2017.
“STAMP, the site of this expansion, is strategically located between Buffalo and Rochester, which enables 1366 Technologies to draw on the highly-skilled and talented workforce available in our region,” said Mark S. Peterson, president and CEO of Greater Rochester Enterprise. “1366 Technologies’ decision to expand its operations here not only marks the largest business attraction success story in our organization’s history, but it also brings two great cities even closer together, strengthening our efforts to make Upstate New York a hot-bed for high-tech development."
“The strategy Governor Cuomo has developed to create a statewide high tech and advanced manufacturing corridor from Albany to Buffalo will change the economic fortunes for Upstate New York for generations to come," said Steve Hyde, president and CEO, Genesee County Economic Development Center (GCEDC). “We are very excited to welcome 1366 Technologies to Genesee County and stand ready to assist the company in any way we can as the first phase of the development of the STAMP site begins.”
“I want to congratulate 1366 Technologies and thank them for bringing this exciting project to upstate New York,” said Buffalo Niagara Enterprise President & CEO Thomas Kucharski. “1366 Technologies is bringing a revolutionary process to an industry that is transforming our regional economy. The very assets and partnerships that attracted 1366 to the STAMP site remain in place, and are well positioned to ensure the success of this company and industry well into the future.”
ABOUT DIRECT WAFER™
1366 Technologies Direct Wafer technology is a transformative manufacturing process that offers significant advantages over traditional cast-and-saw wafer production technologies. The process makes wafers in a single step, pulling them directly from molten silicon instead of today’s multi-step, energy- and capital-intensive approach. The result slashes the cost of the wafer by 50% and sharply reduces capital expenditures and operating costs.
About 1366 Technologies
1366 Technologies aims to deliver solar at the cost of coal. The company combines breakthrough technology innovations with lean manufacturing processes to make a new class of silicon wafers, the building blocks of solar cells, at a fraction of today’s cost. Developed by a veteran team of scientists, engineers and entrepreneurs, the company’s novel approach breaks the historic efficiency and cost tradeoffs of photovoltaics. 1366 Technologies is headquartered in Bedford, MA. For more information, please visit www.1366tech.com.